Aside from the new name, the 7050 largely uses the same technology as the 1080. It is manufactured using TSMC’s advanced 6nm process with two Arm 2.6GHz Cortex-A78 processors and six power-efficient 2.0GHz Arm Cortex-A55 cores with a Mali-G68 MC4 GPU and support for LPDDR5 and LPDDR4x memory as well as UFS 3.1 and 2.1 storage standards. When it comes to display support, it can do a max resolution of 2520 x 1080 and up to 120Hz with video playback topped at 4K at 30 FPS. Formats supported for video playback include HEVC, H.264, MPEG-1/2/4, and VP-9; video encoding support covers HEVC and H.264 with the same resolution and FPS limits as video playback. For photography, the Dimensity 7050 can support up to a whopping 200MP with hardware with 4K HDR video recording and additional features such as hardware HDR, hardware depth engine, warping engine, and AI bokeh using the MediaTek APU 550. When it comes to connectivity, the renamed SoC supports dual SIM 5G, Wi-Fi 6, and Bluetooth 5.2. The MediaTek Dimensity 7050 is expected to debut in the upcoming realme 11 series, with recent benchmark leaks revealing the chipset being used in the 11 Pro Plus, along with 12GB of RAM. realme will be launching the lineup on 10 May, which will reportedly consist of three phones. On a related note, 10 May is also when MediaTek will be unveiling the Dimensity 9200 Plus chipset, its latest flagship offering that will update the Dimensity 9200. The upcoming SoC has reportedly been able to surpass Qualcomm’s Snapdragon 8 Gen 2 in benchmark scores, but it might not be king of the hill for very long as the latter’s rumoured Snapdragon 8 Gen 3 has been spotted on benchmarking platforms, breaking records for Android SoCs. (Source: MediaTek)
